TRU BOND 214 - דבק אפוקסי מוליך חשמל
דבקים וחומרים להיי-טק
TRU-BOND® 214 is a two-part room temperature curing, Electrically conductive epoxy which meets Federal specification MMM-A-1931 types 1 & 2. It is suited for any application where hot soldering is impractical. The adhesive has proven successful in the preparation of conductive paths on circuit boards and in the preparation of electrodes for capacitance and loss measurements. Also used for applications requiring high thermal conductivity.
